AIP Conference Proceedings [AIP STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias - Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany (March 16, 2010 - July 13, 2010 - October 20, 2010)] - PREFACE
Zschech, Ehrenfried, Radojcic, Riko, Sukharev, Valeriy, Smith, LarryYear:
2011
DOI:
10.1063/1.3615692
File:
PDF, 382 KB
2011