A Bunch of Wires (BoW) Interface for Inter-Chiplet...

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A Bunch of Wires (BoW) Interface for Inter-Chiplet Communication

Farjadrad, Ramin, Kuemerle, Mark, Vinnakota, Bapiraju
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Year:
2019
Journal:
IEEE Micro
DOI:
10.1109/MM.2019.2950352
File:
PDF, 246 KB
2019
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