IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
Ren, Ning, Fang, Heng, Wang, Dong, Hou, Chenyi, Zhao, Yatao, Chen, Fan, Tian, Ye, Paik, Kyung-Wook, Wu, YipingVolume:
13
Journal:
Materials
DOI:
10.3390/ma13010252
Date:
January, 2020
File:
PDF, 3.92 MB
2020