![](/img/cover-not-exists.png)
Facile 3D integration of Si nanowires on Bosch-etched sidewalls for stacked channel transistors
Hu, Ruijin, Ma, Haiguang, Yin, Han, Xu, Jun, Chen, Kun Ji, Yu, LinweiYear:
2020
Journal:
Nanoscale
DOI:
10.1039/C9NR09000B
File:
PDF, 1.96 MB
2020