Low-cost bump bonding activities at CERN

Low-cost bump bonding activities at CERN

Vähänen, S, Tick, T, Campbell, M
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
5
Journal:
Journal of Instrumentation
DOI:
10.1088/1748-0221/5/11/C11008
Date:
November, 2010
File:
PDF, 922 KB
2010
Conversion to is in progress
Conversion to is failed