[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - LTCC as substrate - enabling semiconductor and packaging integration
Bartsch, Heike, Pezoldt, Jorg, Sanchez, Francico M. Morales, Rios, Juan J. Jimenez, Delgado, Jose M. Manuel, Breiling, Jonas, Muller, JensYear:
2019
DOI:
10.23919/EMPC44848.2019.8951794
File:
PDF, 1.98 MB
2019