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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment
Schischke, Karsten, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Manessis, Dionysios, Pawlikowski, Jakub, Kupka, Tobias, Krivec, Thomas, Pamminger, Rainer, Glaser, Sebastian, Podhradsky, Gerhard, NiYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951816
File:
PDF, 537 KB
english, 2019