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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - R2R Nano-patterning Technology Using 250 mm-wide Seamless Roller Mold
Komatsu, Kazuma, Abe, Masayuki, Ito, Naoto, Matsui, ShinjiYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733429
File:
PDF, 2.52 MB
english, 2019