Pattern dependent profile distortion during plasma etching...

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films 2020 / 03 Vol. 38; Iss. 2

Pattern dependent profile distortion during plasma etching of high aspect ratio features in SiO 2

Huang, Shuo, Shim, Seungbo, Nam, Sang Ki, Kushner, Mark J.
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Volume:
38
Journal:
Journal of Vacuum Science & Technology A
DOI:
10.1116/1.5132800
Date:
March, 2020
File:
PDF, 4.95 MB
2020
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