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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Thermosonic wedge-wedge bonding using dosed tool heating
Unger, Andreas, Hunstig, Matthias, Brokelmann, Michael, Hesse, Hans J.Year:
2019
DOI:
10.23919/EMPC44848.2019.8951825
File:
PDF, 886 KB
2019