Comparison and mechanism of electromigration reliability...

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Journal of Materials Science: Materials in Electronics 2020 / 1

Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Du, Yahong, Gao, Li-Yin, Yu, Daquan, Liu, Zhi-Quan
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-02840-6
Date:
January, 2020
File:
PDF, 1.78 MB
english, 2020
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