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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - mmWave Antenna Design in Advanced Fan-Out Technology for 5G Application
Hsieh, Sheng-Chi, Chu, Fu-Chen., Ho, Cheng-Yu, Wang, Chen-ChaoYear:
2019
DOI:
10.23919/EMPC44848.2019.8951882
File:
PDF, 571 KB
2019