[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect
Theil, Jeremy A., Mirkarimi, Laura, Fountain, Gill, Gao, Guilian, Katkar, RajeshYear:
2019
DOI:
10.23919/IWLPC.2019.8913862
File:
PDF, 604 KB
2019