![](/img/cover-not-exists.png)
[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products.
Koscielski, Marek, Sitek, Janusz, Ciszewski, Piotr, Dawidowicz, Piotr, Arazna, Aneta, Janeczek, Kamil, Steplewski, Wojciech, Podhradsky, Gerhard, Ambrosch, RolandYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951884
File:
PDF, 754 KB
english, 2019