The effect of Ag on the growth of intermetallics at the...

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Materials Today Communications 2020 / 1

The effect of Ag on the growth of intermetallics at the interface of Sn5Zn/Cu interconnects

Guo, Jian, Zhao, Xiuchen, Liu, Yingxia, Tan, Chengwen, Liu, Lijun, Ning, Xianjin, Nie, Zhihua, Yu, Xiaodong
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Language:
english
Journal:
Materials Today Communications
DOI:
10.1016/j.mtcomm.2020.100960
Date:
January, 2020
File:
PDF, 4.13 MB
english, 2020
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