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[IEEE 2019 IEEE SENSORS - Montreal, QC, Canada (2019.10.27-2019.10.30)] 2019 IEEE SENSORS - Low Stress Packaging of MEMS Sensors via 3D Additive Manufacturing Techniques
Shang, Erwei, Xu, Wei, Yang, Jie, Tang, Bin, Liu, YuYear:
2019
DOI:
10.1109/sensors43011.2019.8956930
File:
PDF, 1.75 MB
2019