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[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Development and validation of a wide band Near Field Scan probe for the investigation of the radiated immunity of Printed Circuit Boards
Durier, Andre, Ben Dhia, Sonia, Dubois, TristanYear:
2019
DOI:
10.23919/EMCTokyo.2019.8893811
File:
PDF, 703 KB
2019