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Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach
Thambi, J., Tetzlaff, U., Schiessl, A., Lang, K.-D., Waltz, M.Volume:
106
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2019.113560
Date:
March, 2020
File:
PDF, 3.15 MB
english, 2020