Thermal stress analysis of printed circuit heat exchanger...

IOP Conference Series Materials Science and Engineering 2020 / 01 Vol. 721

Thermal stress analysis of printed circuit heat exchanger based on thermal-structural coupling method

Wu, Jun, Yao, Shuo, Zhao, Zhenxing, Xiao, Qi, Ke, Zhiwu, Lin, Yuansheng
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Volume:
721
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/721/1/012034
Date:
January, 2020
File:
PDF, 815 KB
english, 2020
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