![](/img/cover-not-exists.png)
[IEEE 2019 X National Conference with International Participation (ELECTRONICA) - Sofia, Bulgaria (2019.5.16-2019.5.17)] 2019 X National Conference with International Participation (ELECTRONICA) - Characterization and Validation Techniques for Thermo-Mechanical Models of Electronic Packages and Assemblies
Stoyanov, Stoyan, Bailey, Chris, Stoynova, AnnaYear:
2019
Language:
english
DOI:
10.1109/ELECTRONICA.2019.8825641
File:
PDF, 4.36 MB
english, 2019