[IEEE 2019 X National Conference with International...

  • Main
  • [IEEE 2019 X National Conference with...

[IEEE 2019 X National Conference with International Participation (ELECTRONICA) - Sofia, Bulgaria (2019.5.16-2019.5.17)] 2019 X National Conference with International Participation (ELECTRONICA) - Characterization and Validation Techniques for Thermo-Mechanical Models of Electronic Packages and Assemblies

Stoyanov, Stoyan, Bailey, Chris, Stoynova, Anna
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2019
Language:
english
DOI:
10.1109/ELECTRONICA.2019.8825641
File:
PDF, 4.36 MB
english, 2019
Conversion to is in progress
Conversion to is failed