[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Advanced Interconnection technology with Laser Assisted Bonding Process for PET Substrate
EOM, Yong-Sung, JANG, Ki-Seok, JOO, Jiho, CHOI, Kwang-SeongYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951858
File:
PDF, 3.00 MB
english, 2019