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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Embedding Technologies for the Manufacturing of Advanced Miniaturised Modules toward the Realisation of Compact and Environmentally Friendly Electronic Devices
Manessis, D., Lang, K-D., Schischke, K., Pawlikowski, J., Krivec, T., Schulz, G., Podhradsky, G., Aschenbrenner, R., Schneider-Ramelow, M., Ostmann, A.Year:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951790
File:
PDF, 5.12 MB
english, 2019