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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Wright, Daniel N., Belle, Branson D., Graff, Joachim S.Year:
2019
Language:
english
DOI:
10.23919/empc44848.2019.8951849
File:
PDF, 1.19 MB
english, 2019