![](/img/cover-not-exists.png)
Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies
Boriskov, P P, Ershova, N Yu, Putrolaynen, V V, Seredov, P N, Belyaev, M AVolume:
1399
Language:
english
Journal:
Journal of Physics: Conference Series
DOI:
10.1088/1742-6596/1399/2/022036
Date:
December, 2019
File:
PDF, 887 KB
english, 2019