[IEEE 2019 5th International Conference on Advances in Electrical Engineering (ICAEE) - Dhaka, Bangladesh (2019.9.26-2019.9.28)] 2019 5th International Conference on Advances in Electrical Engineering (ICAEE) - Thermal Performance Analysis of a Silicon Chip (IC) Mounted on Printed Circuit Board for Different Substrate Materials Based on the Convection Heat Transfer by 3D Finite Element Method

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.