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IEEE Transactions on Power Electronics 2020

Localization and Detection of Bond Wire Faults in Multi-chip IGBT Power Modules

Chen, Cuili, Pickert, Volker, Al-Greer, Maher, Jia, Chunjiang, Ng, Chong
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Year:
2020
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2020.2965019
File:
PDF, 2.09 MB
english, 2020
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