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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Process Flow and Cost Modelling for Fan-Out Panel Level Packaging
Billaud, Mathilde, Zedel, Hannes, Stobbe, Lutz, Braun, Tanja, Nissen, Nils, Lang, Klaus-DieterYear:
2019
DOI:
10.23919/EMPC44848.2019.8951756
File:
PDF, 9.90 MB
2019