[IEEE 2019 22nd European Microelectronics and Packaging...

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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Laser structured passive Components and RF Filter in LTCC Technology with Operating Frequencies up to 40 GHz focusing on 5G Mobile Applications

Schulz, Alexander, Gutzeit, Nam, Muller, Jens
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Year:
2019
DOI:
10.23919/EMPC44848.2019.8951846
File:
PDF, 2.81 MB
2019
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