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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Active Cooling Using Fluid Channels in a Silicon-Ceramic Composite Substrate
Fischer, M., Werthes, T., Kleinholz, C., Muller, J.Year:
2019
DOI:
10.23919/EMPC44848.2019.8951844
File:
PDF, 7.61 MB
2019