Modeling and Characterization of Differential Multi-Bit...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2020

Modeling and Characterization of Differential Multi-Bit Carbon-Nanotube Through-Silicon Vias

Hu, Qing-Hao, Zhao, Wen-Sheng, Fu, Kai, Wang, Gaofeng
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Year:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.2972340
File:
PDF, 2.35 MB
2020
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