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[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Enhanced Package Fault Isolation Method Using Time Domain Reflectometry (TDR) Incorporation with Mathematics
Lee, Lan Yin, Keng Chua, KokYear:
2019
DOI:
10.1109/IPFA47161.2019.8984800
File:
PDF, 845 KB
2019