Research on fatigue of TSV-Cu under thermal and vibration...

Microelectronics Reliability 2020 / 03 Vol. 106

Research on fatigue of TSV-Cu under thermal and vibration coupled load based on numerical analysis

Fan, Zhengwei, Liu, Yao, Chen, Xun, Jiang, Yu, Zhang, Shufeng, Wang, Yashun
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Volume:
106
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113590
Date:
March, 2020
File:
PDF, 5.00 MB
2020
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