[IEEE 2019 IEEE International Electron Devices Meeting...

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[IEEE 2019 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2019.12.7-2019.12.11)] 2019 IEEE International Electron Devices Meeting (IEDM) - Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

Ingerly, D. B., Enamul, K., Gomes, W., Jones, D., Kolluru, K. C., Kandas, A., Kim, G.-S., Ma, H., Pantuso, D., Petersburg, C.F., Phen-givoni, M., Amin, S., Pillai, A. M., Sairam, A., Shekhar, P., Sinh
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Year:
2019
DOI:
10.1109/IEDM19573.2019.8993637
File:
PDF, 4.29 MB
2019
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