[IEEE 2019 IEEE 26th International Symposium on the...

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[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - A new study of backend process on 0.18um BCD NLDMOS on-state BV characteristics

Chen, Shuxian, Lin, Feng, Yang, Bin, Li, Chunxu, Huang, Yu
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Year:
2019
DOI:
10.1109/IPFA47161.2019.8984790
File:
PDF, 319 KB
2019
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