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[IEEE 2019 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2019.12.7-2019.12.11)] 2019 IEEE International Electron Devices Meeting (IEDM) - Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration

Hou, S.Y., Wu, C.H., Yu, Douglas, Hsia, H., Tsai, C.H., Ting, K.C., Yu, T.H., Lee, Y.W., Chen, F.C., Chiou, W.C., Wang, C.T.
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Year:
2019
DOI:
10.1109/IEDM19573.2019.8993498
File:
PDF, 5.72 MB
2019
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