[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low temperature Au-Au direct bonding with highly -oriented Au films
Hsu, Wei-You, Wu, John, Chen, ChihYear:
2019
DOI:
10.23919/LTB-3D.2019.8735410
File:
PDF, 6.78 MB
2019