Dynamic Observation of Interfacial IMC Evolution and...

Materials 2020 / 02 Vol. 13; Iss. 4

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Zhao, Di, Zhang, Keke, Ma, Ning, Li, Shijie, Yin, Chenxiang, Huo, Fupeng
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Volume:
13
Journal:
Materials
DOI:
10.3390/ma13040831
Date:
February, 2020
File:
PDF, 13.68 MB
2020
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