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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Ultra-thin Capacitors in Silicon for 3D-Integration and Flexible Electronics
Pradhan, Mamta, Ferwana, Saleh, Harendt, Christine, Richter, Harald, Burghartz, Joachim N.Year:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951886
File:
PDF, 2.31 MB
english, 2019