[IEEE 2019 25th International Workshop on Thermal...

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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Optimum Thermal Design of High-Voltage Double-Sided Cooled Multi-Chip SiC Power Modules

Catalano, Antonio Pio, Scognamillo, Ciro, Castellazzi, Alberto, d'Alessandro, Vincenzo
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Year:
2019
Language:
english
DOI:
10.1109/THERMINIC.2019.8923763
File:
PDF, 3.29 MB
english, 2019
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