[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Optimum Thermal Design of High-Voltage Double-Sided Cooled Multi-Chip SiC Power Modules
Catalano, Antonio Pio, Scognamillo, Ciro, Castellazzi, Alberto, d'Alessandro, VincenzoYear:
2019
Language:
english
DOI:
10.1109/THERMINIC.2019.8923763
File:
PDF, 3.29 MB
english, 2019