[IEEE 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Pattaya, Chonburi, Thailand (2019.7.10-2019.7.13)] 2019 16th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON) - Thermal Behavior of FDM 3D Printing by Using Arduino Mega 2560 Approach
Promarin, Kasem, Somwang, PreechaYear:
2019
Language:
english
DOI:
10.1109/ECTI-CON47248.2019.8955265
File:
PDF, 297 KB
english, 2019