Analytical prediction of subsurface microcrack damage depth...

Materials Science in Semiconductor Processing 2020 / 06 Vol. 112

Analytical prediction of subsurface microcrack damage depth in diamond wire sawing silicon crystal

Wang, Liyuan, Gao, Yufei, Li, Xinying, Pu, Tianzhao, Yin, Youkang
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Volume:
112
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2020.105015
Date:
June, 2020
File:
PDF, 2.54 MB
2020
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