Temperature Gradient Method for Alleviating...

Sensors 2020 / 02 Vol. 20; Iss. 4

Temperature Gradient Method for Alleviating Bonding‐Induced Warpage in a High‐Precision Capacitive MEMS Accelerometer

Liu, Dandan, Liu, Huafeng, Liu, Jinquan, Hu, Fangjing, Fan, Ji, Wu, Wenjie, Tu, Liangcheng
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
20
Language:
english
Journal:
Sensors
DOI:
10.3390/s20041186
Date:
February, 2020
File:
PDF, 1.82 MB
english, 2020
Conversion to is in progress
Conversion to is failed