Reliable single-phase micro-joints with high melting point...

Journal of Alloys and Compounds 2020 / 07 Vol. 828

Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye, Fang, Heng, Ren, Ning, Zhao, Yatao, Chen, Boli, Wu, Fengshun, Paik, Kyung-Wook
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Volume:
828
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2020.154468
Date:
July, 2020
File:
PDF, 1.85 MB
english, 2020
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