[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Sintering of oxide-free copper pastes for the attachment of SiC power devices
Carro, Luca Del, Liu, Chunlei, Koller, Fabio, Zinn, Alfred A., Brunschwiler, ThomasYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951838
File:
PDF, 6.45 MB
english, 2019