SiO2-SiO2 die-to-wafer direct bonding interface weakening

Microelectronics Reliability 2020 / 04 Vol. 107

SiO2-SiO2 die-to-wafer direct bonding interface weakening

Tabata, Toshiyuki, Sanchez, Loic, Larrey, Vincent, Fournel, Frank, Moriceau, Hubert
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Volume:
107
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113589
Date:
April, 2020
File:
PDF, 1.50 MB
2020
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