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Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
Sun, Tao, Song, Hong-wu, Hua, Fu-an, Li, Jian-pingVolume:
7
Journal:
Materials Research Express
DOI:
10.1088/2053-1591/ab6c0a
Date:
January, 2020
File:
PDF, 1.53 MB
2020