[IEEE 2019 Electrical Design of Advanced Packaging and...

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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Fast Physical Verification for 16nm Package Electrical Performance

Shi, Hong, Lee, Chao-Chin, Chu, Chia-Hui, Chiou, Shian-Min, Chiu, Po-Wei, Leung, Dennis
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Year:
2019
DOI:
10.1109/EDAPS47854.2019.9011678
File:
PDF, 7.61 MB
2019
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