A study of Integrated Circuit Dicing Tape when used in a Plasma Dicing Environment (Sept 2019)
Fulton, Harry, Ansell, Oliver, Hopkins, Janet, Hanicinec, Martin, Nishida, Takuo, Umemoto, Taku, Li, LijieYear:
2020
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.2966724
File:
PDF, 4.18 MB
2020