[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Process integration of a direct-on-metal, non-etchback, κ=2.5 spin-on polymer for the 0.18 μm CMOS technology node
Sum, J.C., Ray, G.W., Ma, S., Kavari, R., MacInnes, L.M., Treadwell, C.A., Dunne, J., Hacker, N.P., Figge, L.K., Hendricks, N.Year:
1999
DOI:
10.1109/iitc.1999.787116
File:
PDF, 1.57 MB
1999