![](/img/cover-not-exists.png)
[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Enhanced Stack-up for EMC, SI and PI in Mixed-Signal Systems
Voina, R. G., Viman, L., Pitica, D.Year:
2019
DOI:
10.1109/siitme47687.2019.8990889
File:
PDF, 3.80 MB
2019